features
• excellent thermal transfer
• good thermal and aging stability
• flexible, stress relieving
• outstanding gap fill
benefits
• easy application
• good dielectric properties
potential uses
• thermal management material for led
devices
application methods
• screen print
• stencil print
• dispense
dow corning® tc-5625 thermally
condutive compound
one part, silicone paste
typical properties
specification writers: please contact your local dow corning sales office or your global
dow corning connection before writing specifications on this product.
property unit value
viscosity cp
mpa-sec
pa-sec
102125
102125
102.1
specific gravity (uncured) - 4.2
nvc (non volatile content) % 99.93
thermal conductivity btu/hr ft degf
w/mk
4.325
2.5
thermal resistance @ 25n/cm2 ºc*cm2/w 0.1
bond line thickness inch
mm
0.01
0.03
dielectric strength volts/mil
kv/mm
1825
72
volume resistivity

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昆山卡斯曼电子有限公司销售部
王玻
15162657011
中国 苏州